STPS15H100CB-TR Diode Array, Schottky 100V 7.5A DPAK, Surface Mount
The STPS15H100CB-TR is a high-quality Schottky diode array designed for efficient power conversion and fast recovery applications. It features a 100V DC reverse voltage rating, 7.5A average rectified current per diode, and a low forward voltage drop of 800mV at 7.5A. This surface-mount device comes in a DPAK package, offering reliable performance in compact designs. With a maximum junction temperature of 175°C, it is suitable for a wide range of industrial and automotive applications. Available in Tape & Reel, Cut Tape, and Digi-Reel® packaging options for easy integration into automated assembly lines.
Features
High Logic Capacity: It offers up to 12,000 logic elements, making it suitable for complex logic designs and applications.
Multiple I/O Standards: It supports various input and output standards with flexible I/O configuration to meet the needs of different application scenarios.
Integrated ADC: It features a built-in 12-bit ADC for convenient analog signal processing, minimizing the need for external components.
Power Management: It supports multiple power supply voltage options and has low power consumption characteristics, making it ideal for mobile and portable devices.
Fast Development: It is compatible with Quartus Prime software, providing a wealth of development tools and design resources to shorten the development cycle.
Specifications
Logic Resources
Memory Resources
Input/Output (I/O)
Clock and Performance
Analog Functions
Power and Consumption
Package Type
Temperature Range
Development Support
Applications
Communication
- Network Devices: Used for signal processing and data routing in routers, switches, and base stations. - Wireless Communication: Handles modulation, demodulation, and signal encoding in wireless systems.
Industrial Control
- Automation Systems: Control logic for PLCs (Programmable Logic Controllers) and other automation devices.- Data Acquisition: Sensor data collection and processing in industrial environments.
